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Download full textGuu, Y. H.; Lin, Kuen-Yi; Lee, Lung-Sheng – Turkish Online Journal of Educational Technology - TOJET, 2014
This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of two-tier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies,…
Descriptors: Foreign Countries, Engineering, Technical Occupations, Competence
