This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of two-tier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies,…

The central purpose of this study was to expand upon previous research in relation to competencies that are desired by university engineering faculty in their incoming freshman. This study used a Delphi technique as noted by Paige, Dugger, and Wolansky (1996) and Wicklein (1993) to identify and analyze what secondary education competencies should…

Fifty-one manufacturing experts selected 48 competencies that should be included in competency tests for manufacturing technologists and engineers. Areas include mathematics, physics, sciences, engineering drawing and blueprint reading, engineering materials, and statics and strength of materials. (SK)