ERIC Number: EJ1463147
Record Type: Journal
Publication Date: 2024
Pages: 13
Abstractor: As Provided
ISBN: N/A
ISSN: N/A
EISSN: EISSN-2472-2707
Available Date: 0000-00-00
Digital Twin and Cybersecurity in Additive Manufacturing
Journal of Cybersecurity Education, Research and Practice, v2024 n1 Article 32 2024
Additive manufacturing (AM) has been applied to automotive, aerospace, medical sectors, etc., but there are still challenges such as parts' porosity, cracks, surface roughness, intrinsic anisotropy, and residual stress because of the high level of thermal gradient. It is significant to conduct the modeling and simulation of the AM process and achieve quality products. Digital Twin (DT) can help AM with forecasting defects/errors through simulation and real-time process monitoring. DT is a concept of Industry 4.0, and its digital structure reflects the real-time behaviors of a cyber-physical or physical system. This paper introduces the progress of DT applications in AM, cyber digital twin (CDT), cybersecurity digital twin, and cybersecurity in AM, and highlights the challenges of DT and cybersecurity in AM. A case study is presented, including the flaw formation of laser powder bed fusion (LPBF) due to cyber intrusions and the flaw formation during the printing process of LPBF, the impacts of the factors of cyber resilience on the AM supply chain, and cyberattacks on various data categories of AM and their business impacts. The methods and related information in this paper not only help promote professionals' research and development in the industry, but also are very useful for faculty's research and teaching as well as students' learning in the areas of DT, AM, and cybersecurity.
Descriptors: Computer Security, Computer Science, Artificial Intelligence, Computer Simulation, Manufacturing, Printed Materials, Printing, Error Correction, Computer Oriented Programs, Information Storage, Computer Networks, Information Technology
Kennesaw State University. 1000 Chastain Road, Kennesaw, Georgia 30144. Tel: 470-578-3568; e-mail: cybersec@kennesaw.edu; Web site: https://digitalcommons.kennesaw.edu/jcerp/
Publication Type: Journal Articles; Reports - Research
Education Level: N/A
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Grant or Contract Numbers: N/A
Author Affiliations: N/A